1. The ratio of chip area to packaging area should be as close to 1:1 as possible to improve packaging efficiency.
2. The leads should be kept as short as possible to reduce delay, while the distance between leads should be maximized to ensure minimal interference and enhance performance.
3. Based on thermal management requirements, thinner packaging is crucial. The performance of the CPU directly affects the overall performance of the computer. The final and most critical step in CPU manufacturing is the packaging technology. Different packaging techniques can result in significant performance differences in CPUs. Only high-quality packaging technology can produce perfect IC products.
4. For RF communication baseband ICs, the modems used in communication are similar to the modems used for internet access on computers.
Post time: Nov-18-2024