Samsung Electronics' Device Solutions division is accelerating the development of a new packaging material called "glass interposer", which is expected to replace the high - cost silicon interposer. Samsung has received proposals from Chemtronics and Philoptics to develop this technology using Corning glass and is actively evaluating cooperation possibilities for its commercialization.
Meanwhile, Samsung Electro - Mechanics is also advancing the research and development of glass carrier boards, planning to achieve mass production in 2027. Compared with traditional silicon interposers, glass interposers not only have lower costs but also possess more excellent thermal stability and seismic resistance, which can effectively simplify the micro - circuit manufacturing process.
For the electronic packaging materials industry, this innovation may bring new opportunities and challenges. Our company will closely monitor these technological advancements and strive to develop packaging materials that can better match the new semiconductor packaging trends, ensuring that our carrier tapes, cover tapes, and reels can provide reliable protection and support for the new - generation semiconductor products.
Post time: Feb-10-2025