ASML, a global leader in semiconductor lithography systems, has recently announced the development of a new extreme ultraviolet (EUV) lithography technology. This technology is expected to significantly improve the precision of semiconductor manufacturing, enabling the production of chips with smaller features and higher performance.
The new EUV lithography system can achieve a resolution of up to 1.5 nanometers, a substantial improvement over the current generation of lithography tools. This enhanced precision will have a profound impact on semiconductor packaging materials. As chips become smaller and more complex, the demand for high - precision carrier tapes, cover tapes, and reels to ensure the safe transportation and storage of these tiny components will increase.
Our company is committed to closely following these technological advancements in the semiconductor industry. We will continue to invest in research and development to develop packaging materials that can meet the new requirements brought about by ASML's new lithography technology, providing reliable support for the semiconductor manufacturing process.
Post time: Feb-17-2025