On September 13, 2024, Resonac announced the construction of a new production building for SiC (silicon carbide) wafers for power semiconductors at its Yamagata Plant in Higashine City, Yamagata Prefecture. The completion is expected in the third quarter of 2025.
The new facility will be located within the Yamagata Plant of its subsidiary, Resonac Hard Disk, and will have a building area of 5,832 square meters. It will produce SiC wafers (substrates and epitaxy). In June 2023, Resonac received certification from the Ministry of Economy, Trade and Industry as part of the supply assurance plan for important materials designated under the Economic Security Promotion Act, specifically for semiconductor materials (SiC wafers). The supply assurance plan approved by the Ministry of Economy, Trade and Industry requires an investment of 30.9 billion yen to strengthen the SiC wafer production capacity at the bases in Oyama City, Tochigi Prefecture; Hikone City, Shiga Prefecture; Higashine City, Yamagata Prefecture; and Ichihara City, Chiba Prefecture, with subsidies of up to 10.3 billion yen.
The plan is to start supplying SiC wafers (substrates) to Oyama City, Hikone City, and Higashine City in April 2027, with an annual production capacity of 117,000 pieces (equivalent to 6 inches). The supply of SiC epitaxial wafers to Ichihara City and Higashine City is scheduled to begin in May 2027, with an expected annual capacity of 288,000 pieces (unchanged).
On September 12, 2024, the company held a groundbreaking ceremony at the planned construction site at the Yamagata Plant.
Post time: Sep-16-2024